EMLC Organizing Committee

Programme Chairs  Mr. J. Waelpoel, ASML, Veldhoven, The Netherlands
                                      Dr. W. Maurer, InfineonTechnologies AG, Munich, Germany

The International Steering Committee of the European Mask and Lithography Conference, EMLC2007

The names marked with (*) are in addition members of the program Committee.
The names underlined are in addition the members of the Grenoble local committee.

Mr. F. Abboud	Intel Corp., Santa Clara, CA
Mr. M. Archuletta	RAVE LLC Nanomachining, Saint Petersburg, FL, USA
Dr. M. Arnz	Carl Zeiss SMT AG, Oberkochen, Germany(*)
Dr. A. Barberet	IBM Microelectronics, New York, USA
Dr. U. Behringer	UBC Microelectronics, Ammerbuch Germany(*)
Dr. C. Blaesing-Bangert	Vistec Semiconductor Systems, Wetzlar, Germany
Dr. W. Brünger	FhG-ISIT, Itzehoe, Germany
Mr. P Chen	Taiwan Mask Corp., Hsinchu,Taiwan(*)
Dr. C. Constantine	Oerlikon USA Inc., St. Petersburg, FL, USA
Prof. R. Engelstad	University of Wisconsin, Madison, WI, USA
Mr. D. Farrar	HOYA Corporation, LONDON, UK
Mr. M. Fischer	KLA Tencor GmbH, Puchheim, Germany
Mr. O. Fortagne	Vistec Semiconductor Systems GmbH, Jena, Germany
Mr. C. Gale	Applied Materials, Dresden,Germany(*)
Mr. B. Grenon	Grenon Consulting, Inc., Colchester,VT, USA(*)
Mr. H. Hartmann	s3solution, Munich, Germany
Mr. N. Hayashi	Dai Nippon Printing Co. Ltd., Saitama, Japan
Dr. A.C. Hourd	Compugraphics International Ltd., Glenrothes, Scotland, UK(*)
Mr. R. Jonckheere	IMEC, Leuven, Belgium(*)
Dr. C.K.. Kalus	SIGMA-C AG, Munich, Germany(*)
Mr. K.R. Kimmel	IBM Albany Nanotech Facility, Albany, USA
Prof. A. Kostka	Technical University of Darmstadt, Germany
Mr. H. Lehon	KLA-Tencor Corporation, San Jose, CA, USA
Dr. H. Loeschner	IMS Nanofabrication AG, Vienna, Austria *
Dr. W. Maurer	Infineon, Munich, Germany(*)
Mr. B. Naber	Cadence Design Systems Inc., San Jose, USA(*)
Mr. E. Rausa	Oerlikon USA Inc., Saint Petersburg, FL, USA
Dr. C. Reita	CEA-LETI, Grenoble, France(*)
Dr. F. Reuther	micro resist technology GmbH, Berlin, Germany
Dr. C. Romeo	ST-Microelectronics, Agrate Brianza, Italy(*)
Mr. K. Ronse	IMEC, Leuven, Belgium
Prof. H. Scheer	University of Wuppertal Wuppertal, Germany(*)
Mr. Gerd Scheuring	Mue Tec GmbH, Munich, Germany
Dr. R. Schnabel	VDE/VDI-GMM Frankfurt, Germany(*)
Mr. M. Staples	AMD Saxony LLC & Co. KG, Dresden, Germany
Mrs. I. Stolberg	Vistec Semiconductor Systems GmbH, Jena, Germany(*)
Dr. R. Takke	Heraeus Quarzglas GmbH & Co.KG, Kleinostheim, Germany
Mr. K. Tasaki	KLA-Tencor Japan Ltd., Yokohama City, Japan
Dr. S. Tedesco	CEA-LETI, Grenoble, France(*)
Mr. M. Tissier	Toppan Photomasks S.A., Rousset Cedex, France(*)
Mr. G: Unger	Infineon Technologies AG, Munich, Germany(*)
Mr. J. Waelpoel	ASML, Veldhoven, NL(*)
Mr. J.T. Weed	SYNOPSYS, Inc., Mountain View, CA, USA
Mr. J. Whittey	Vistec Semiconductor Systems, Oakdale, CA, USA(*)
Mr. J. Wiley	Brion Technologies, Santa Clara, CA, USA
Mr. H Wolf	Photronics MZD GmbH, Dresden, Germany(*)
Mr. N. Yoshioka	Renesas Technology Corp., Tokyo, Japan
Mr. L. Zurbrick	KLA-Tencor Corporation, San Jose, CA, USA(*)